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CORE-RK3568-LP32: 55×55×3.1mm Industrial Core Board with 1TOPS NPU & Dual PCIe 3.0

CORE-RK3568-LP32

Industrial Grade | LCC/LGA Hybrid Package | Full Signal Fan-out | -40°C to 85°C
  • Industrial Grade | LCC/LGA Hybrid Package | Full Signal Fan-out | -40°C to 85°C
  • LGA+LCC packaging ensures superior vibration resistance
  • EMI shield bracket planned for interference protection
  • Full RK3568J fan-out delivers versatile I/O mapping
  • Low-power design suits battery-powered edge applications
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Description

Product Overview

CORE_RK3568_LP32 is a 55×55×3.1mm industrial module powered by the RK3568J SoC, integrates quad Cortex-A55 (up to 2.0GHz), 1TOPS NPU, and Mali-G52 GPU in single-sided SMT layout. It combines full I/O fan-out, low-power operation, and rugged packaging for rapid integration in edge AI, industrial automation, and embedded vision applications.

Key Features

1. Compact Reliability
  • Use 0402 components to balance board density and long-term stability.
2. Industrial Resilience
  • Hybrid LCC(1.1mm)/LGA(2.0mm) packaging passes 20Grms vibration; -40°C cold-start operation.
3. Design Flexibility
  • 272-pin full fan-out enables dual PCIe 3.0, 2xGMAC, and 8xUART without compromises.
4. Risk-Free Deployment
  • Linux 5.10 LTS BSP + turnkey design services accelerate deployment to 6 weeks.
5. Customization Supported
  • Hardware: Core board customization (pin-compatible upgrade). Software: Debian/Ubuntu BSP pre-adaptation.
6. Ideal Applications
  • Pre-validated Linux 5.10 LTS BSP with Qt 5.15 certification reduces bring-up to ≤8 weeks.

 

Technical Specifications

CORE_RK3568_LP32
CPURK3568/RK3568J; 64bit; 22nm
4x ARM Cortex-A55 RK3568 : 2.0GHz RK3568J: 1.6GHz; CAN UP TO 2.0GHz
1xRISC-V: 150MHz
NPU: 1TOPS Support: INT8/INT16/FP16/BFP16 Support: TensorFlow/PyTorch/Caffe/MXNet
GPU: Mali-G52-2EE Support: OpenGL ES 1.1/2.0/3.2; OpenCL 2.0; Vulkan 1.0/1.1
ISP: 8M; Support HDR
Decoder: 4K@60fps H.265/H.264
Encoder: 1080P@60fps H.265/H.264
ROM8/16/32GByte eMMC
RAM1/2/4GByte LPDDR4/LPDDR4X
VIDEO IN1xMIPI CSI; 4 data lane; Support 2X2 lane or 1X4 lane
VIDEO OUT1xHDMI OUT
1xEDP
2xLVDS/MIPI DSI
AUDIO1xMIC
1xSPK; 2xHP
PCIe1xPCIe 3.0×2
1xPCIe 2.0×1
GMAC2x; RMII/RGMII PHY
USB2xUSB3.0
2xUSB2.0
SDx2
I2Sx1
I2Cx4
UARTx8
CANx2
GPIOx35
SARADCx3
LED1x; System state index
INTERFACE4x47PIN(LCC; 1.1mm) + 4x21PIN(LGA; 2.0mm); 272PIN
POWER3.3V±5%
SIZE55*55*3.1MM
SOFTWAREDebian-11 (Linux-5.10.198)
Buildroot-2021.11 (Linux-5.10.198)
Ubuntu20.04 (Linux-5.10.198 XFCE)
Qt-5.15.10
Required lib and drive

Application Scenarios

Wearable medical devices, robotic controllers, and defense systems requiring compute density under extreme conditions.

Configuration Options

1. Processor: RK3568 → RK3568J (industrial grade chip)

2. Memory: 4GB → 8GB/16GB LPDDR4/LPDDR4X

3. Storage: 1GB → 2GB/4GB eMMC

Why Choose Us?

  • One-stop turnkey solution: From PCB design to PCBA mass production.
  • Core Customization: Scale memory, optimize I/O, or white-label firmware.
  • Qt 5.15.10 Pre-Compiled: Rapid GUI development for HMI/control panels.
  • Certification Ready: Pre-tested for FCC/CE EMI compliance (with shield). RoHS-compliant assembly.

Additional information

CPU

4xARM Cortex-A55

GPU

Mali-G52-2EE

NPU

1 TOPS

Video Interfaces

1xMIPI CSI, 4 DATA LANE, SUPPORT 2X2 LANE OR 1X4 LANE, 1xHDMI OUT, 1xEDP, 2xLVDS/MIPI DSI, 1xMIC, 1xSPK, 2xHP, I2S X1

Data Interfaces

1xPCIe 3.0×2, 1xPCIe 2.0×1, 2x RMII/RGMII PHY, 2xUSB3.0, 2xUSB2.0, SD x2

I/O Interfaces

I2C x4, UART x8, GPIO x35, SARADC x3, CAN x2

Mechanical Dimension

55*55*3.1mm

Operating Temperature

2 options: 0~70°C and -40~+85°C

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    Industrial Automation

    Medical Device

    Transportation

    Energy Systems

    <100 units

    100-1K

    1K-5K

    >5K



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