It Solution

Image

COM Express Type6 ARM-FPGA single board  computer | Industrial Compact Motherboard

COMe_TYPE6_RK3588-V2.2

Industrial-Grade ARM Module for Robotics/Medical/AV Systems – 64×80mm Size, 50% Faster Deployment
  • RK3588 ARM+XC7A50T FPGA heterogeneous acceleration
  • Wide temperature operation -40~85°C for harsh condition
  • It allows direct replacement of X86 COMe modules
  • PCle3.0, SATA3.0, MIPI, CAN and GTP multi interface support
  • FPGA support custom hardware logic for diverse applications
Categories: , ,

Description

Product Overview

The COMe_TYPE6_RK3588-V2.2 Single Board Computer is an industrial FPGA computing board for advanced control & processing. Designed for high-reliability scenarios such as industrial automation and rail transportation, this COM Express Type6 embedded board integrates the RK3588 ARM SOC and XC7A50T FPGA to achieve seamless collaboration between high-performance computing and hardware acceleration. Fully compliant with COM.0 R2.1 Type 6 and measuring just 95 × 95 mm, it allows direct replacement of x86 COMe modules without carrier redesign. Supporting operation from -40°C to 85°C and featuring rich interfaces including PCIe3.0, SATA3.0, MIPI, CAN, GTP, it provides a flexible and stable hardware platform for industrial control, machine vision, data acquisition, and more.

Key Features

1. COM Express Type6 Drop-in Compatibility

Strictly compliant with the <COM Express Module Base Specification COM.0 R2.1> Type6 standard and seamlessly replace X86 COMe modules.

2. Compact Structure 95x95mm:

Adheres to COM Express Compact specifications, ideal for space-constrained industrial PCs and edge computing devices.

3. ARM+FPGA Heterogeneous Computing Architecture:

High-speed interconnection between the RK3588 ARM SOC and Xilinx FPGA via PCIe 2.0, UART, and I2C, ensures real-time control and large-scale data transmission.

4. Comprehensive Interfaces of the computing board:

Standard Interfaces: Gigabit Ethernet, SATA 3.0, USB 3.0, HDMI 2.1, MIPI DSI/CSI/CAN. Extended Interfaces: GTP, LVDS (FPGA-driven)

5. Wide-Temperature Operation:

Dual versions available: -20°C to 70°C and -40°C to 85°C(rugged industrial-grade), tailored for demanding environments like power systems and rail transportation.

6. Low-Power Consumption:

Typical power consumption of 10W-15W, combining the RK3588J SOC, LPDDR4 16GB, and FPGA for high-performance efficiency.

Dual core heterogeneous architecture

ARM Side: Rockchip RK3588 (4×Cortex-A76 + 4×Cortex-A55) with LPDDR4 (up to 32GB) and eMMC 5.1 (up to 256GB)

FPGA Side: Xilinx Artix-7 XC7A50T-2FGG484I (Upgradable to XC7A100T) with MT25QL256ABA1EW7 SPI Flash for bitstream storage

 
Core ComponentsInterface & Compatibility
Front SideBack SideStandard InterfacesIndustrial Protocols
  • RK3588 SoC
  • LPDDR4 CXDB5CCAM-MK
  • XC7A50T-2FGG484I FPGA
  • RK806-1 PMIC
  • GM8775C MIPI-LVDS x2
  • YT8531SH GbE PHY x2
  • MT25QL256 SPI Flash
  • DDR3 MT41K256M16TW-107IT:P
  • 2×GbE (YT8531SH PHY)
  • 4×USB 3.0
  • HDMI 2.1 + DP 1.4
  • SRIO, Aurora, CAN 2.0B
  • RS485 with surge protection
  • FPGA GPIO
Industrial grade signal integrity
Display Flexibility:

2×HDMI, 1×DP, 1×MIPI‑DSI, 1×LVDS (via GM8775C), 5 independent outputs for simultaneous multi‑display control

Network Reliability:

Dual YT8531SH Gigabit Ethernet PHY, equipped with industrial grade EMC protection

 

Technical Specifications

 
COMe_TYPE6_RK3588
ITEMDESCRIPTION
CPURK3588/RK3588J;8nm;64bit
4xARM Cortex-A76 RK3588 : 2.4GHz RK3588J:1.6GHz;CAN UP TO 2.0GHz
4xARM Cortex-A55 RK3588 : 1.8GHz RK3588J: 1.3GHz;CAN UP TO 1.7GHz
3xARM Cortex-M0(PMU_M0、NPU_M0、DDR_M0) PMU_M0: 200MHz NPU_M0;DDR_M0 UNOPEN
NPU: 6TOPS SUPPORT:INT4/INT8/INT16/FP16/BF16/TF32 SUPPORT:TensorFlow/PyTorch/Caffe/MXNet
GPU: Mali-G610 MP4 SUPPORT: OpenGL ES 1.1/2.0/3.2;OpenCL 2.2;Vulkan 1.2
ISP: 2xISP(ISP0/ISP1);support HDR;3DNR; SUPPORT CAMERA: 48M: 8064×6048@15fps dual ISP 32M: 6528×4898@30fps dual ISP 16M: 4672×3504@30fps single ISP
DECODER:8K@60fps H.265、8K@30fps H.264
ENCODER: 8K@30fps H.265/H.264
ROM:32/64/128GByte eMMC
RAM:4/8/16GByte LPDDR4X
GBE:2x
SATA:1xSATA3.0
PCIe:1xPCIe 3.0×4/4xPCIe 3.0×1;1xPCIe 2.1×1
USB:1xType-C(USB3.0);1xUSB3.0;2xUSB2.0
Video OUT:1xMIPI DSI(DCPHY 4LANE);1xLVDS(MIPI TO LVDS); 1xHDMI OUT;1xDP
Video IN:1xMIPI CSI(DPHY);1xHDMI IN
SPI:x1
I2S:x1
SARADC:x3
UART:x2
I2C:x2
GPIO:x5
FPGAXC7A50T-2FGG484I
Logic Cells:52160
CLBs Slices:8150 Max Distributed RAM(Kb):600
DSP48E1 Slices:120
Block RAM Blocks 18 Kb:150 36 Kb:75 Max(Kb)2700
CMTs:5
PCIe:1
GTPs:4(ONE FOR PCIe2.0 WITH RK3588;THREE FOR OUT)
Max User:250
ROM:256Mbit QSPI FLASH
RAM:1GByte DDR3
IO:36(3.3V BANK14);30(3.3V BANK15);6(2.5V BANK16)
LVDS:16 PAIRS(BANK16)/(32 IO 2.5V)
MCUPY32F002BF15U6TR;32bit
Cortex-M0;24MHz
24KByte FLASH
3KByte SRAM
IO:x18
CPU TO FPGAI2C:x3
UART:x2
GPIO:7
PCIe2.0:X1
LED5x
INTERFACEB2B CONNECTOR;COMe Type6;440PIN
POWER12V±5%;5V±5%;
SIZE95*95*8.1MM
SOFTWAREDebian 11(Linux-5.10.160)
Buildroot-2021.11(Linux-5.10.160)
Ubuntu20.04(Linux-5.10.160 XFCE)
Qt-5.15.10
Required lib and drive

Application Scenarios

Mission-Critical Control with Precision Timing

Scenario: Railway Signal System

 

Technical correlation:

FPGA achieves real-time acquisition of track signals through isolated GPIO

Dual YT8531SH PHY supports hot redundant network communication

GM8775C driver LVDS display screen presents scheduling information

Configuration Options

Standard version basic configuration:

RK3588 ARM processor | 8GB LPDDR4 | 32GB eMMC | XC7A50T FPGA

 

Flexible upgrade options

(price adjustment for changing configurations, please contact sales for details):

1. Processor: RK3588 → RK3588J (industrial grade chip)

2. Memory: 8GB → 12GB/32GB (maximum supported)

3. Storage: 32GB → 64GB/128GB/256GB eMMC

4. FPGA: XC7A50T (basic) → XC7A100T (doubling logical resources)

(Note: All configurations maintain 100% mechanical compatibility with COM ExpressType 6)

Why Choose Us?

Provide one-stop R&D services from schematic design to hardware delivery: based on Xilinx FPGA, Rockchip ARM, TI DSP and other platforms, focusing on high-speed digital circuit research and development and complex architecture design for 10 years; Support 2-20 layers of PCB and blind buried hole technology, with daily delivery of 400PIN; Integrate material procurement, precision welding, and debugging, with a rapid response time of 72 hours. With industrial grade high reliability standards (defect rate ≤ 0.1%), we assist customers in industrial control, new energy, intelligent equipment and other fields to accelerate product implementation.

Additional information

CPU

4xARM Cortex-A76+ 4xARM Cortex-A55+ 3xARM Cortex-M0 (PMU_M0, NPU_M0, DDR_M0)

Inquire about this product

    Contact Us










    We’ll send BSP docs to this address


    Industrial Automation

    Medical Device

    Transportation

    Energy Systems

    <100 units

    100-1K

    1K-5K

    >5K



    No file chosen

    We never share your design files

    By submitting this form, you agree to our
    Privacy Policy (GDPR compliant)





    Leave a comment

    Select more than one item for comparison.