CORE-RK3566: Ultra-Compact Industrial-Grade Compute Module for Edge AI & IoT
CORE-RK3566
55×55×3.6mm Fan-out Design | LCC Reliability | 1TOPS NPU | Linux Ready
- Single-sided component placement for high reliability
- LCC package ensures anti-vibration mounting
- EMI shield bracket planned for interference protection
- RK3566 full fan-out simplifies custom I/O designs
- Mass production ready, stable and easy to deploy
Description
Product Overview
An ultra-compact (55×55×3.6mm) ARM-based compute module integrating Rockchip’s RK3566 SoC. Features quad-core Cortex-A55 (1.8GHz), 1TOPS NPU, and Mali-G52 GPU in a single-sided SMT design. Providing full I/O access, compact LCC design, and optional EMI shielding. Ideal for industrial gateways, embedded vision, and light AI workloads in space-constrained environments.
Key Features
1. Space-Optimized Integration
- 55mm² ultra-dense core and LCC packaging enable direct embedding in space-constrained devices (medical handhelds, robotics).
2. Manufacturing-Ready Reliability
- Single-sided placement simplifies assembly (30% faster SMT) and allows X-ray-free QC. EMI shield compatibility meets EN 55032 standards.
3. Full-Performance Access
- 100% signal fan-out exposes all interfaces (PCIe 2.0, dual MIPI-DSI, 10x UART) for custom carrier board designs.
4. Risk-Reduced Deployment
- Pre-validated with Linux 5.10 LTS (Debian/Ubuntu/Buildroot) and mass-production proven BOM.
5. Built for Harsh Environments
- LCC anchors + single-layer SMT withstand 5G vibration
Technical Specifications
| CORE_RK3566 | ||||||||||
| CPU | RK3566; 64bit; 22nm | |||||||||
| 4xARM Cortex-A55; 1.8GHz | ||||||||||
| NPU: 1TOPS Support: INT8/INT16 Support: TensorFlow/PyTorch/Caffe/MXNet | ||||||||||
| GPU: Mali-G52-2EE Support: OpenGL ES 1.1/2.0/3.2; OpenCL 2.0; Vulkan 1.1 | ||||||||||
| ISP: 8M; Support HDR | ||||||||||
| Decoder: 4K@60fps H.265/H.264/VP9 | ||||||||||
| Encoder: 1080P@60fps H.265/H.264 | ||||||||||
| ROM | 8/16/32GByte eMMC | |||||||||
| RAM | 1/2/4GByte LPDDR4 | |||||||||
| VIDEO IN | 1xMIPI CSI; 4 data lane; Support 2X2 lane or 1X4 lane | |||||||||
| VIDEO OUT | 1xHDMI OUT | |||||||||
| 1xEDP | ||||||||||
| 2xLVDS/MIPI DSI | ||||||||||
| AUDIO | 1xMIC | |||||||||
| 1xSPK; 2xHP | ||||||||||
| PCIe | 1xPCIe 2.0×1 | |||||||||
| GMAC | 1x; RMII/RGMII PHY | |||||||||
| USB | 1xUSB3.0 | |||||||||
| 3xUSB2.0 | ||||||||||
| SD | x2 | |||||||||
| I2S | x1 | |||||||||
| I2C | x3 | |||||||||
| UART | x10 | |||||||||
| GPIO | x38 | |||||||||
| SARADC | x2 | |||||||||
| LED | 1x; System state index | |||||||||
| INTERFACE | 4x56PIN(LCC; 0.9mm); 224PIN | |||||||||
| POWER | 3.3V±5% | |||||||||
| SIZE | 55*55*3.6mm | |||||||||
| SOFTWARE | Debian-11 (Linux-5.10.198) | |||||||||
| Buildroot-2021.11 (Linux-5.10.198) | ||||||||||
| Ubuntu20.04 (Linux-5.10.198 XFCE) | ||||||||||
| Qt-5.15.10 | ||||||||||
| Required lib and drive | ||||||||||
Application Scenarios
Ideal for: Vision systems, industrial HMIs, and AI gateways requiring compute density, thermal resilience (0°C~70°C), and rapid time-to-market.
Configuration Options
1. Memory: 8GB → 16GB/32GB LPDDR4
2. Storage: 1GB → 2GB/4GB eMMC
Why Choose Us？
Reduce Integration Risk:
- Pre-tested BOM with mass-production pedigree
- Full schematics (PDF) provided
Accelerate Development:
- Carrier board design/production services
- Custom core board configurations
- Qt 5.15 pre-validated
Deploy Anywhere:
- 0°C~70°C operating range (implied by LCC)
- Dual-display support for HMI applications
Additional information
| CPU | 4xARM Cortex-A55 |
|---|---|
| GPU | Mali-G52-2EE |
| NPU | 1 TOPS |
| Video Interfaces | 1xMIPI CSI, 4 DATA LANE, SUPPORT 2X2 LANE OR 1X4 LANE, 1xHDMI OUT, 1xEDP, 2xLVDS/MIPI DSI, 1xMIC, 1xSPK, 2xHP, I2S X1 |
| Data Interfaces | 1xPCIe 2.0×1, 1x RMII/RGMII PHY, 1xUSB3.0, 3xUSB2.0, SD x2 |
| I/O Interfaces | I2C x3, UART x10, GPIO x38, SARADC x2 |
| Mechanical Dimension | 55*55*3.6mm |
| Operating Temperature | 2 options: 0~70°C and -40~+85°C |
