
CORE-RK3568-SBC: Dual-GbE Industrial Core Board with PCIe 3.0 & Wide-Temp Operation
CORE_RK3568_SBC
Rugged Edge Compute Core for Industrial Modernization
- 65×65×3.1 mm ultra-compact SBC with 0402 components
- LGA/LCC packaging, EMI shield mounts, –40 °C–85 °C
- 272-pin breakout: 2×GbE, PCIe3.0×2, SATA, CAN, GPIO
- Integrated 1 TOPS NPU and quad-core Cortex-A55 CPU
- Pre-validated Linux 5.10 LTS BSP with turnkey Support
Description
Product Overview
A 65×65×3.1mm industrial SBC module featuring Rockchip’s RK3568J SoC (-40°C~85°C) with dual GbE, PCIe 3.0, and onboard EDP-to-VGA conversion. Integrates quad Cortex-A55 (2.0GHz), 1TOPS NPU (FP16 Support), and Mali-G52 GPU. Engineered for Industrial Automation & IIoT Gateways, Transportation & Smart Infrastructure, Energy & Heavy Machinery, Retail & Hospitality Kiosks, etc.
Key Features
1. 272-pin Full Fan-out
- Features 2× CAN, SATA3, PCIe3.0, and 30× GPIO without hardware multiplexing constraints, make it ideal for complex industrial deployments.
2. Industrial Networking Dominance
- Dual independent GbE PHYs enable network redundancy/aggregation; PCIe 3.0×2 (16Gbps) Supports high-speed expansion.
3. RK3568J Industrial SoC
- RK3568J Supports dynamic frequency scaling (1.6→2.0GHz) under thermal stress, suitable for applications that require high environmental adaptability
4. Legacy Interface Integration
- Onboard EDP-to-VGA IC eliminates external adapters, extends legacy equipment lifecycle 5-7 years.
5. Extreme Environment Ready
- LGA 2.0mm anchors + industrial-grade RK3568J pass -40°C cold-start tests.
6. Deployment Accelerator
- Pre-validated Linux 5.10 LTS BSP with Qt 5.15 certification reduces bring-up to ≤8 weeks.

Technical Specifications
CORE_RK3568_SBC | ||||||||||
CPU | RK3568/RK3568J; 64bit; 22nm | |||||||||
4x ARM Cortex-A55 RK3568: 2.0GHz RK3568J: 1.6GHz; Can up to 2.0GHz | ||||||||||
1xRISC-V: 150MHz | ||||||||||
NPU: 1TOPS Support: INT8/INT16/FP16/BFP16 Support: TensorFlow/PyTorch/Caffe/MXNet | ||||||||||
GPU: Mali-G52-2EE Support: OpenGL ES 1.1/2.0/3.2; OpenCL 2.0; Vulkan 1.0/1.1 | ||||||||||
ISP: 8M; Support HDR | ||||||||||
Decoder: 4K@60fps H.265/H.264 | ||||||||||
Encoder: 1080P@60fps H.265/H.264 | ||||||||||
ROM | 8/16/32GByte eMMC | |||||||||
RAM | 1/2/4GByte LPDDR4 | |||||||||
VIDEO IN | 1xMIPI CSI; 4 data lane; Support 2X2 lane or 1X4 lane | |||||||||
VIDEO OUT | 1xHDMI OUT | |||||||||
1xVGA(EDP TO VGA)/EDP | ||||||||||
2xLVDS/MIPI DSI | ||||||||||
AUDIO | 1xMIC | |||||||||
1xSPK; 2xHP | ||||||||||
PCIe | 1xPCIe 3.0×2 | |||||||||
1xPCIe 2.0×1 | ||||||||||
GBE | 2x | |||||||||
USB | 1xUSB3.0 | |||||||||
3xUSB2.0 | ||||||||||
SATA | 1xSATA3.0 | |||||||||
SD | x2 | |||||||||
I2S | x1 | |||||||||
I2C | x3 | |||||||||
UART | x8 | |||||||||
CAN | x2 | |||||||||
SPI | x1 | |||||||||
GPIO | x30 | |||||||||
SARADC | x7 | |||||||||
LED | 1x; System state index | |||||||||
INTERFACE | 4x61PIN(LCC; 1.0mm) + 2x14PIN(LGA; 2.0mm); 272PIN | |||||||||
POWER | 3.3V±5% | |||||||||
SIZE | 65*65*3.1MM | |||||||||
SOFTWARE | Debian-11 (Linux-5.10.198) | |||||||||
Buildroot-2021.11 (Linux-5.10.198) | ||||||||||
Ubuntu20.04 (Linux-5.10.198 XFCE) | ||||||||||
Qt-5.15.10 | ||||||||||
Required lib and drive |
Application Scenarios
Engineered For: Machine vision controllers, IIoT gateways, and medical devices requiring deterministic networking, wide-temperature operation, and legacy display Support.
Configuration Options
1. Processor: RK3568 → RK3568J (industrial grade chip)
2. Memory: 4GB → 8GB/16GB LPDDR4/LPDDR4X
3. Storage: 1GB → 2GB/4GB eMMC
Why Choose Us?
- One-stop turnkey solution: From PCB design to PCBA mass production.
- Core Customization: Scale memory, optimize I/O, or white-label firmware.
- Qt 5.15.10 Pre-Compiled: Rapid GUI development for HMI/control panels.
- Certification Ready: Pre-tested for FCC/CE EMI compliance (with shield). RoHS-compliant assembly.
Additional information
CPU | 4xARM Cortex-A55 |
---|---|
GPU | Mali-G52-2EE |
NPU | 1 TOPS |
Video Interfaces | 1xMIPI CSI, 4 DATA LANE, SUPPORT 2X2 LANE OR 1X4 LANE, 1xHDMI OUT, 1xVGA(EDP TOVGA)/EDP, 2xLVDS/MIPI DSI, 1xMIC, 1xSPK, 2xHP, I2Sx1 |
Data Interfaces | 1xPCIe 3.0×2, 1xPCIe 2.0×1, 1xUSB3.0, 3xUSB2.0, SD x2, GBE x2, 1xSATA3.0 |
I/O Interfaces | I2C x3, UART x8, GPIO x30, SARADC x7, CAN x2, SPI x1, |
Mechanical Dimension | 65*65*3.1mm |
Operating Temperature | 0~70°C |