
8K AI Edge Computing Module – Rockchcip RK3588|6TOPS NPU|Dual 8K Display
CORE_RK3588
Industrial-Grade ARM Module for Robotics/Medical/AV Systems – 64×80mm Size, 50% Faster Deployment
- SoC: RK3588 (4×A76@2.4GHz + 4×A55@1.8GHz) + 6 TOPS NPU
- Memory: 8/16/32 GB LPDDR4/LPDDR4X
- Storage: 32/64/128 GB eMMC
- I/O: 4×PCIe3.0×1, 1×SATA3.0, 2× RGMII, 2×HDMI2.1, 2×MIPI CSI, 2× CAN
- Power: 4.0V±5%
Description
Product Overview
CORE_RK3588 Industrial SoM is a high-performance edge computing module powered by Rockchip’s flagship RK3588 processor, optimized for AIoT and industrial automation. Featuring dual-channel LPDDR4 memory, dual 15Gbps high-speed connectors, and industrial-grade wide-temperature operation (-40℃~85℃), it delivers robust computing power for machine vision, 8K multimedia processing, and predictive maintenance. With 10+ years lifecycle commitment and Android/Debian dual-OS Support, this module enables mid-sized enterprises to rapidly deploy customized industrial AI solutions.
Key Features
1.Flagship Performance: Redefining the New Standard for Industrial AI with Computing Power Density
Rockchip 8nm RK3588 Heterogeneous Architecture
- CPU: 4×Cortex – A76 @ 2.4GHz + 4×Cortex – A55 @ 1.8GHz→ Compared with competitors (such as NXP i.MX8): Multi – core performance improved by 220% (based on SPECint2006 test)
- NPU: 6TOPS computing power Supports INT8/INT16 mixed quantization→ Typical scenario: Run YOLOv5s (30fps) + DeepSort algorithm (60fps) simultaneously
Dual – channel LPDDR4X – 4266 Memory
- Peak bandwidth of 68.3GB/s → Meet the requirements of real – time analysis of 4 channels of 4K video streams
- Optional 8GB/16GB/32GB configurations → Avoid cost waste caused by over – configuration
2. Industrial – Grade Reliability: Full – Range Protection from the Laboratory to Extreme Fields
Cold start at – 40°C and full – load operation at 85°C
- Measured data: Startup time at – 40°C ≤ 8 seconds (competitors generally > 15 seconds)
8 – layer PCB + Complete ground plane
- EMC optimization: Radiated noise reduced by 20dBμV/m compared with conventional 4 – layer boards (in the EN 55032 standard frequency band)
- Power integrity: IR Drop < 50mV (@12V input at full load)
3. High – Speed Interconnection: Zero Bottlenecks for Data Flow
Dual 15Gbps board – to – board connectors
- Single connector Supports PCIe 3.0×4 + USB3.1 Gen2×2 + Multiple LVDS
- Typical application: Cascade 3 core boards → Build a computing power cluster with 24 – core CPU + 18TOPS NPU
Full – link 8K video pipeline
- Decoding: 8K@60fps H.265/H.264
- Encoding: 8K@30fps → Meet the requirements of real – time recording of surgical images
4. Lifecycle and Customization: The Invisible Competitiveness of Medium – Sized Enterprises
10 – year long – term supply commitment
- Key components (RK3588/LPDDR4/PMIC) are stocked until 2033
- Comparative solution: Renesas RZ/G2L only promises a 5 – year supply
In – depth hardware customization
- Baseboard interfaces: Support the on – demand combination of PCIe3.0/PCIe2.0/CAN/RS485/PoE+
- Software adaptation: Provide standard BSPs for Yocto/OpenWRT/ROS 2
Technical Specifications
ITEM | DESCRIPTION | |||||||||
CPU | RK3588 / RK3588J; 8nm; 64bit | |||||||||
4xARM Cortex-A76 RK3588: 2.4GHz RK3588J: 1.6GHz; Can up to 2.0GHz | ||||||||||
4xARM Cortex-A55 RK3588: 1.8GHz RK3588J: 1.3GHz; Can up to 1.7GHz | ||||||||||
3xARM Cortex-M0 (PMU_M0, NPU_M0, DDR_M0) PMU_M0: 200MHz NPU_M0; DDR_M0 UNOPEN | ||||||||||
NPU: 6TOPS Support: INT4/ INT8/ INT16/ FP16/ BF16/ TF32 Support: TensorFlow/ PyTorch/ Caffe/ MXNet | ||||||||||
GPU: Mali-G610 MP4 Support: OpenGL ES 1.1/ 2.0/ 3.2; OpenCL 2.2; Vulkan 1.2 | ||||||||||
ISP: 2xISP (ISP0/ISP1); Support HDR; 3DNR; Support Camera: 48M: 8064×6048@15fps dual ISP 32M: 6528×4898@30fps dual ISP 16M: 4672×3504@30fps single ISP | ||||||||||
Decoder:8K@60fps H.265, 8K@30fps H.264 | ||||||||||
Encoder: 8K@30fps H.265/ H.264 | ||||||||||
ROM | 32/ 64/ 128GByte eMMC | |||||||||
RAM | 4/ 8/ 16GByte LPDDR4/ 4X | |||||||||
Video IN | 2xMIPI CSI (DCPHY) | |||||||||
2xMIPI CSI (DPHY) | ||||||||||
1xHDMI IN | ||||||||||
Video OUT | 2xHDMI/ eDP OUT | |||||||||
1xDP TX | ||||||||||
2xMIPI DSI (DCPHY) | ||||||||||
PCIe | 1xPCIe 3.0×4 / 4x PCIe 3.0×1 | |||||||||
1xPCIe 2.1×1 | ||||||||||
GMAC | 2x; RMII/ RGMII PHY | |||||||||
USB | 1xType-C | |||||||||
1xUSB3.1 | ||||||||||
2xUSB2.0 | ||||||||||
SATA | 1xSATA3.0 | |||||||||
I2S | x1 | |||||||||
I2C | x6 | |||||||||
UART | x5 | |||||||||
CAN | x2 | |||||||||
SPI | x1 | |||||||||
GPIO | x17 | |||||||||
SARADC | x5 | |||||||||
CLOCK | x2; 100MHz; HCSL; Source Synchronous with PCIe 3.0 Clock | |||||||||
INTERFACE | B2B 15Gbps Connector; 360Pin | |||||||||
POWER | 4.0V±5% Stable Power Input | |||||||||
SIZE | 64*80*7.6mm (2.5×3.15×0.3in) | |||||||||
SOFTWARE | Debian 11 (Linux-5.10.160) | |||||||||
Buildroot-2021.11 (Linux-5.10.160) | ||||||||||
Ubuntu20.04 (Linux-5.10.160 XFCE) | ||||||||||
Qt-5.15.10 | ||||||||||
Required lib and drive |
Target Applications
Industrial Automation
Real-Time Machine Vision Quality Inspection | PLC Control Gateway | Predictive Maintenance Terminal
Smart City & Retail
4K Digital Signage Controller | Smart Vending Machine Main Controller | Traffic Flow Analysis Device
Medical & Defense
Portable Ultrasound Imaging System | Military-Grade Communication Relay Module
Configuration Options
1. Processor: RK3588 → RK3588J (industrial grade chip)
2. Memory: 8GB → 16GB/32GB LPDDR4/LPDDR4X
3. Storage: 32GB → 64GB/128GB eMMC
Why Choose Us?
✓ Industrial Scene Optimization Design
- EMC Enhancement: 8-Layer PCB + Complete Ground Plane, can Pass EN 55032 Pre-Compliance Testing
- Long Lifecycle: 10+ Years Component Supply Commitment (2023–2033)
- Customization Support: Computing Board Reference Design Provided (HDMI/CAN/RS485 Interface Expansion)
✓ Developer-Friendly Ecosystem
- Dual System Support: Android 12 / Debian 11 BSP SDK
- Open Source Toolchain: Yocto/OpenWRT/ROS 2 Humble Adaptation Guides
- Rapid Prototyping: Free 3D Models and Pin Definition Diagrams Provided
✓ Certification Ready
- Pre-tested for CE/FCC/ROHS – Accelerate your product’s time-to-market!
Additional information
CPU | 4x ARM Cortex-A76 + 4x ARM Cortex-A55 |
---|---|
GPU | Mali-G610 MP4 |
NPU | 6 TOPS |
Video Interfaces | 2xMIPI CSI(DCPHY), 2xMIPICSI(DPHY), 1xHDMI IN, 2xHDMI/eDP OUT, 1xDP TX, 2xMIPI DSI(DCPHY), I2S x1 |
Data Interfaces | 1xPCIe 3.0 x4/4x, PCIe 3.0 x1, 1xPCIe 2.1 x1, 2x RMII/RGMII PHY, 1xTypeC, 1xUSB3.1, 2xUSB2.0, 1xSATA3.0 |
I/O Interfaces | I2C x1, UART x6, CAN x2, SPI x1, GPIO x17, SARADC x5 |
Mechanical Dimension | 64*80*7.6mm |
Operating Temperature | 2 options: 0~70°C and -40~+85°C |